FAQ

Glaser™ technology utilizes the controlled thermal stress cleaving process. The glass gets cut because of the high temperature gradient induced locally by the laser beam operating at the 10,6 micrometers. At this wavelength glass is fully opaque and all the physics happen at the very thin surface layer of glass.

This is the major difference to the other known techniques such as filamentation and nanoperforation, where specifically shaped visible laser beam modifies the bulk of glass.

We use our own patented laser.

Our laser operates in the high repetition rate (33 kHz) Q-switched ns-pulsed regime. Other pulsed CO2 lasers operate in a quasi-periodic regime. As a direct consequence of the genuine Q-switching, our laser demonstrates superior two orders of magnitude average-to-peak power conversion and therefore extra-high peak power. 

Average power is 100W, but the peak pulse power is up to 20kW.

No, processing is done by a single beam in one pass.

No, we do it with the same laser.

Because the edge is fully de-stressed and not modified by the beam.

Because there’s no chipping on the edge.

According to the results of the standard-based bending tests at the certified testing lab, the edge strength is improved x3-4 compared to the wheel-scored glass.

We have cut 12 mm glass, but it’s not the limit.

Yes, with the same beam, applying a multi-pass process.

It depends on the glass type and thickness. In case of chamfering also the required size of chamfer affects the processing speed.

Speed up to 100 mm/s can be obtained for chamfering.